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Lam Research (LRCX) FY2026 results: revenue $23.2 billion, up 26.0% on the year

Lam Research Corp. (LRCX) reported revenue of $23.2 billion for fiscal 2026, the year ended 28 June 2026, up 26.0% on the year before. Net income was $7.3 billion, up 35.6%, and diluted earnings per share $5.76. The figures are the company's own, from the 10-K it filed with the SEC on 7 August 2026.

Revenue
$23.2 billion
+26.0% on the year
FY2019FY2026
Operating margin
35.3%
32.0% a year earlier
FY2019FY2026
Net income
$7.3 billion
+35.6% on the year
FY2019FY2026
Diluted EPS
$5.76
+38.8% on the year
FY2019FY2026

this yearthe year beforeHover a bar for its figure.

The year in brief

What management said about the year

Guidance figures: 4 raised, 1 kept.

  • Record revenue, margins and earnings: Revenue rose 15.1% from the March 2026 quarter to $6.72 billion. U.S. GAAP gross margin, operating margin and diluted EPS were each higher than in the March 2026 quarter.
  • Revenue, margin and EPS ranges raised: Each guided line for the quarter ending September 27, 2026 is higher than the ranges given on April 22, 2026 for the June 2026 quarter, except the diluted share count.
  • Gross margin rose to 51.7%: U.S. GAAP gross margin was 51.7% of revenue against 49.8% in the March 2026 quarter. Non-GAAP gross margin was 52.0% against 49.9%.
  • Operating margin reached 37.4%: U.S. GAAP operating margin was 37.4% against 35.0% in March. Non-GAAP operating margin was 38.4% against 35.0%.
  • Deferred revenue rose to $2.43 billion: Deferred revenue rose from $2.22 billion at the March 2026 quarter end. The balance excludes Japan shipments, which are carried as inventory at cost until customer acceptance.
Read the Q4 FY2026 earnings call summary

From this 10-K

Lam Research was incorporated in Delaware in 1980, is headquartered in Fremont, California and keeps a network of facilities across Asia, Europe and the United States. It supplies wafer fabrication equipment and services to the semiconductor industry, with competencies it lists as nanoscale manufacturing enablement, chemistry, plasma and fluidics, systems engineering and operational disciplines. The filing describes its customers as memory makers, foundries and integrated device manufacturers producing non-volatile memory, dynamic random-access memory and logic devices, whose chips go into mobile phones, personal computers, cloud and enterprise servers, wearables, vehicles and data storage. Making those chips means repeating a set of core processes over hundreds of individual steps, integrating new materials with control at the atomic scale, on equipment that also has to be productive and cost-effective.

Lam Research Corp., the 10-K for 2026

Lam Research was incorporated in Delaware in 1980, is headquartered in Fremont, California and keeps a network of facilities across Asia, Europe and the United States. It supplies wafer fabrication equipment and services to the semiconductor industry, with competencies it lists as nanoscale manufacturing enablement, chemistry, plasma and fluidics, systems engineering and operational disciplines. The filing describes its customers as memory makers, foundries and integrated device manufacturers producing non-volatile memory, dynamic random-access memory and logic devices, whose chips go into mobile phones, personal computers, cloud and enterprise servers, wearables, vehicles and data storage. Making those chips means repeating a set of core processes over hundreds of individual steps, integrating new materials with control at the atomic scale, on equipment that also has to be productive and cost-effective.

What is driving demand

The company points to demand for electronic systems supporting artificial intelligence, cloud infrastructure, communications, automotive and industrial uses, which needs high performance, energy efficient and highly integrated devices. Because traditional two-dimensional scaling is getting harder, manufacturers are turning to vertical scaling, three-dimensional architecture, more sophisticated patterning, new materials and advanced integration, all of which raise manufacturing complexity and precision requirements. The company argues that several things differentiate it: research and development across sustaining engineering, product and process development and feasibility work; cycles of learning drawn from a broad installed base; collaboration with ecosystem partners and closeness to customers; investment across the breadth of its portfolio; and delivery of multi-product solutions.

Deposition, etch and clean

Deposition creates the insulating and conducting layers of a device: electrochemical deposition makes the copper wiring that links devices on a chip, chemical vapour and atomic layer deposition build tiny molybdenum or tungsten connectors and thin barriers a few atomic layers at a time, and plasma-enhanced and atomic layer processes form the critical insulating films, with treatments such as ultraviolet thermal processing improving them. Etch creates chip features by selectively removing dielectric, metal, silicon and poly silicon material, with reactive ion etch enabling transistor performance, storage capacitors and memory cells, and low temperature cryogenic etching allowing new chemistries for high aspect ratio work. Clean steps clear particles, contaminants and residues between manufacturing steps and prepare the wafer surface, with wet processing for cleaning and etch and plasma bevel cleaning removing material from the wafer edge. Product families include ALTUS, SABRE, Striker and VECTOR in deposition, Akara, Flex, Kiyo, Syndion, Vantex and Versys Metal in etch, and Coronus, DV-Prime, Da Vinci, EOS and the SP Series in clean.

Dry resist and packaging

Dry extreme ultraviolet resist is a patterning approach the company says raises device scaling and pattern density while cutting cost and complexity; instead of wet-spin processing the film is formed by gas-phase deposition, which it describes as giving superior molecular purity and image fidelity with less environmental impact, sold as the Aether family. It also addresses back-end wafer-level packaging, an alternative to wire bonding that can give a smaller form factor, faster interconnect and lower power use, including fan-out panel-level packaging, where chips are cut from a substrate sheet several times the size of a silicon wafer to raise yield, and three-dimensional stacking of high bandwidth memory. Its products also suit related markets that rely on semiconductor processes, such as complementary metal-oxide-semiconductor image sensors and micro-electromechanical systems.

Services, selling and people

The Customer Support Business Group sells products and services meant to keep installed equipment performing, covering customer service, spares, upgrades and refurbished older-generation products across deposition, etch and clean. Many technical advances in the newest products are also sold as upgrades, which the company presents as a cost-effective way to extend existing fabrication lines, while its Equipment Intelligence services work on uptime, throughput and defect reduction and the spares line on running costs and product life. The Reliant line within that group sells new and refurbished older-generation products for applications that do not need the most advanced processing. Marketing and sales run through product marketing and sales staff alongside equipment and process engineers working with individual customers, backed by service engineers across the United States, China, Europe, India, Japan, Korea, Southeast Asia and Taiwan, and systems carry a standard warranty against defects in material and workmanship. Much of its sales and operations sit outside the United States, exposing the company to export restrictions, tariffs, staffing and management difficulties, tax consequences, currency movements and political conditions. At 4 August 2026 it had approximately 23,300 regular full-time employees, over 26% of them in research and development, approximately 38% in the United States, 56% in Asia and 6% in Europe.

From Lam Research's annual report on Form 10-K for the year ended 28 June 2026. The filing

Written from the 10-K filed 7 August 2026: read the full 10-K.

The four quarters: Q1 FY2026 · Q2 FY2026 · Q3 FY2026 · Q4 FY2026

Income statement (profit and loss)

$ millionFY2026FY2025FY2024On the yearLast 8 years
Revenue23,23318,43614,905+26.0%
Cost of revenue11,5079,4577,853+21.7%
Gross profit11,7258,9797,053+30.6%
Gross margin50.5%48.7%47.3%
Research and development2,3762,0961,902+13.3%
Selling, general and administrative1,150982868+17.1%
Operating income8,2005,9014,264+39.0%
Operating margin35.3%32.0%28.6%
Interest expense157178185-12.0%
Pre-tax income8,2625,9584,360+38.7%
Income tax997600532+66.2%
Effective tax rate12.1%10.1%12.2%
Net income7,2655,3583,828+35.6%
Net margin31.3%29.1%25.7%
Diluted EPS$5.76$4.15$2.90+38.8%
$ million except per share.
Read moreFree cash flow is operating cash flow less capital expenditure; the effective tax rate is income tax over pre-tax income; margins are the line over revenue. Gross profit is revenue less cost of revenue, and operating income is revenue less the company's own total costs, where the statement does not print those lines. Those four are arithmetic on the filed numbers; everything else is as filed. Money is in $ million as the company files it, or in $ billion by the switch above the tables; per share figures and share counts are as they are.

Cash flow

$ millionFY2026FY2025FY2024On the yearLast 8 years
Operating cash flow5,8586,1734,652-5.1%
Capital expenditure966759397+27.3%
Free cash flow4,8915,4144,256-9.7%
Free cash flow margin21.1%29.4%28.6%
Cash from investing-922-708-371
Cash from financing-5,718-4,937-3,996
Depreciation and amortisation442386360+14.3%
Share-based compensation386343293+12.5%
Buybacks3,8513,4222,843+12.5%
Dividends paid1,2711,1501,019+10.5%
Dividend per share$1.04$0.92$0.80+13.0%
Diluted shares, weighted1,261m1,290m1,320m-2.3%
Shares outstanding at period end1,251m1,269m1,304m-1.4%

Balance sheet

$ millionFY2026FY2025FY2024On the yearLast 8 years
Shareholders' equity12,4719,8628,539+26.5%
Debt3,7224,4694,967-16.7%
Operating lease liabilities297193223+53.4%
Finance lease liabilitiesn/an/a12.5
Other liabilities7,0406,8215,002+3.2%
Total liabilities and equity23,53021,34518,745+10.2%
Fixed assets2,9362,4062,130+22.1%
Goodwill1,6301,6301,6000.0%
Intangible assets269182139+47.8%
Cash and equivalents5,5796,3915,848-12.7%
Receivables5,3403,3782,519+58.1%
Inventory4,2764,3084,218-0.7%
Other assets3,4993,0512,291+14.7%
Total assets23,53021,34518,745+10.2%

10-K for the year ended 28 June 2026, filed 7 August 2026: the filing.